DiSTAP-meriSTEM@NIE workshop for STEM educators to enhance their capacity in STEM curriculum design
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On 25 October 2023, researchers from SMART’s Disruptive and Sustainable Technologies for Agricultural Precision (DiSTAP)...
A Day in the Life of: Muhammad Sayyid Aly, Senior Research Engineer at SMART DiSTAP
Meet Muhammad Sayyid Aly, Senior Research Engineer at the Disruptive and Sustainable Technologies for Agricultural Precision...
The people behind SMART CAMP: James Strutt, Senior Postdoctoral Researcher
A dedicated researcher with a passion for nature and plants, James Strutt is a Senior Postdoctoral Researcher at the Critical Analytics...
Celebrating Howard Califano's Impact as Director of SMART Innovation Centre
Howard Califano, SMART Innovation Centre Senior Strategic Advisor and Director from 2009 - 2023, sharing about his tenure
DiSTAP IRG research highlights
Advancing Agritech for Food Security and a Sustainable Future In a world where we're grappling with climate change, a growing global...
A Day in the Life of: Kaixi Zhang, Senior Postdoctoral Associate at SMART AMR
Meet Kaixi Zhang, a Senior Postdoctoral Associate at the Antimicrobial Resistance Interdisciplinary Research Group (AMR IRG) in SMART....
SMART researchers uncover novel bacterial communication system to combat antimicrobial resistance
(L to R) Dr Cui Liang, Dr Lee Wei Lin, Dr Ho Peiying and Prof Peter Dedon used mass spectrometry technology developed at SMART and MIT to...
SMART launches new research group M3S to advance AI, automation and the future of work
SMART M3S Lead Principal Investigator and MIT Professor, Professor Jinhua Zhao (Credit: SMART M3S) Five-year multi-million-dollar...
SMART researchers discover novel combination therapy to counter antibiotic-resistant Mycobacterium
abscessus infections SMART AMR researchers Peiying Ho, Sharon Ling, Boon Chong Goh, and Patrina Chua (from left to right) performed...
SMART researchers create world’s smallest LED and holographic microscope that enable conversion
of existing mobile phone cameras into high-resolution microscopes a) Fully fabricated 300mm wafer (b) Close-up of chip die (c) Infrared...
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